Circuit substrate and its manufacturing method
US7084512B2 · kind B2 · utility
8Cited by
8References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2002 |
| Grant date | Aug 1, 2006 |
| Priority date | — |
| Expiry date | Nov 20, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10083
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit substrate has a flexible thin film, electric wires supported on the film, and an electronic component supported on the film and positioned between the wires so that the wires and the component are electrically connected serially. Also, a thickness of the component is less than that of the electric wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.