Chip coil and printed circuit board for the same
US7084730B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 23, 2004 |
| Grant date | Aug 1, 2006 |
| Priority date | — |
| Expiry date | Aug 23, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Electrodes and land patterns are provided at no magnetic flux concentrated positions or at positions that influence the magnetic fluxes issued from the core of a chip coil. The chip coil has a pair of electrodes which is formed at the center of a base on which a core of the chip coil is mounted, lead frames, flange-shaped brims, conductive parts and a conductive wire. The ends of the conductive wire are connected to internal electrodes which are provided on both brims, respectively, and external electrodes are extended so as to protrude from the sides of a core drum. Also, the signal patterns and the land patterns are arranged at the positions that do not allow overlapping with the brims of the core of the chip coil. This allows implementation of a chip coil and a printed circuit board for the same that allow reduction in magnetic loss.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.