Method of forming a feature having a high aspect ratio
US7086138B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 5, 2001 |
| Grant date | Aug 8, 2006 |
| Priority date | — |
| Expiry date | Jun 23, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49043
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming high aspect ratio metallization on a wafer is implemented in the formation of a disc drive recording head. The process involves patterning photoresist where metal is to be later deposited, milling around the photoresist perimeter, depositing insulating material in the milled region, around and over the photoresist, then dissolving the photoresist to be replaced with metal. The process features the ability to desirably increase the aspect ratio of height to width of a metallization on a wafer. An improved aspect ratio can be utilized to improve the quality of a write pole in a recording head, effectively increasing its achievable recording density.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.