Magazine, assembly device for microcomponents

US7086145B2 · kind B2 · utility

Assignee

• Institut für Mikrotechnik Mainz GmbH · DE

Inventors

• Wolfgang Ehrfeld · Karlsruhe, DE
• Matthias Nienhaus · Mainz, DE
• Udo Berg · Darmstadt, DE
• Felix Schmitz · Mainz, DE
• Marc Begemann · Barntrup, DE
• Yannick Ansel · Mainz, DE

Key dates

• Filing date: Feb 27, 2001
• Grant date: Aug 8, 2006
• Expiry date: Mar 27, 2022

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/53513
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

The invention relates to an assembly device for microcomponents that are disposed in a magazine. The inventive assembly device does not require any optical systems and allows for an exact positioning of the microcomponents. The assembly will also be unaffected by any position changes of the microcomponents caused by wastage. The assembly device is provided with mechanical alignment devices that engage with or act upon adjustment structures of the magazine. The assembly device further comprises clamping devices for fixing the magazine and at least one plunger for ejecting at least one microcomponent from the magazine. An assembly platform is provided in the upper tool or in the lower tool of the assembly device and receives the microcomponents in a defined position. The invention further relates to a method for assembling microcomponents and to a corresponding magazine.