Overmolded vial for use with a level
US7086167B2 · kind B2 · utility
4Cited by
12References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 16, 2004 |
| Grant date | Aug 8, 2006 |
| Priority date | — |
| Expiry date | Apr 16, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01C25/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A vial for use in a level and a method of forming such a vial are disclosed. The vial includes a cylinder having an inner surface defining a cavity, and a material molded around the cylinder. The vial preferably includes at least one marker ring positioned between the cylinder and the material. The method comprises providing the cylinder; molding a material around the cylinder; machining the inner surface to a desired shape; and positioning a bubble in the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.