Pressure sensor with single deposit adhesive
US7086290B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2004 |
| Grant date | Aug 8, 2006 |
| Priority date | — |
| Expiry date | Dec 9, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/0052
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Pressure sensor methods and systems are disclosed. In general, two micromachined die and a diaphragm for a pressure sensor can be provided. The two micromachined die can be embedded in a glass adhesive on a surface of the diaphragm, such that the glass adhesive possesses a large size relative to the two micromachined die. The large size of the glass adhesive creates a large planar target for placement of the two micromachined die upon the diaphragm, thereby providing a size difference between the glass adhesive and the two micromachined die thereby creates an optimum strain transfer, while maintaining stability for the pressure sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.