Surface mount header assembly having a planar alignment surface
US7086913B2 · kind B2 · utility
12Cited by
15References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2005 |
| Grant date | Aug 8, 2006 |
| Priority date | — |
| Expiry date | Feb 25, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/0263
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A header assembly includes an insulative housing having a plurality of walls defining an interior cavity extending along a mating axis, and a plurality of contacts within the cavity and extending through one of the walls to an exterior of the housing for surface mounting to a circuit board. The insulative housing includes at least one alignment rib extending on an exterior surface thereof in a direction substantially perpendicular to the mating axis. The contacts are formed against and abutting the alignment rib, thereby ensuring coplanarity of the contacts for surface mounting to a circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.