Polishing pad
US7086932B2 · kind B2 · utility
7Cited by
15References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 11, 2004 |
| Grant date | Aug 8, 2006 |
| Priority date | — |
| Expiry date | May 11, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.