Cellulose-containing polishing compositions and methods relating thereto
US7086935B2 · kind B2 · utility
13Cited by
7References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 24, 2004 |
| Grant date | Aug 8, 2006 |
| Priority date | — |
| Expiry date | Feb 9, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/04
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An aqueous composition is useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The composition comprises an oxidizer, an inhibitor for the nonferrous metal, 0.001 to 15 weight percent of a water soluble modified cellulose, non-saccaride water soluble polymer, 0 to 15 weight percent phosphorus compound, 0.005 to 10 weight percent of a water miscible organic solvent, and water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.