Chemical mechanical polishing retaining ring with integral polymer backing
US7086939B2 · kind B2 · utility
5Cited by
21References
45Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2004 |
| Grant date | Aug 8, 2006 |
| Priority date | — |
| Expiry date | Sep 28, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In one embodiment, the disclosure is directed to a chemical mechanical polishing retaining ring. The chemical mechanical polishing retaining ring includes a support formed of a first material comprising a first polymer and a wear portion formed of a second material comprising a second polymer. The first material has an elastic modulus greater than the elastic modulus of the second material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.