Patent · US Expired

Method for fabricating micro-structures with various surface properties in multi-layer body by plasma etching

US7087181B2 · kind B2 · utility

15Cited by
5References
41Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 30, 2001
Grant dateAug 8, 2006
Priority date
Expiry dateJul 1, 2021

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2203/0554
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

The technology is based on the anisotropic plasma etching of organic polymer sheets partially protected by a metallic mask. The originality of the process is to pattern the surface properties by the same physical means as the one used for the three dimensional fabrication and simultaneously to this fabrication. Surface properties means, but are not limited to hydrophobicity, hydrophilicity, conductivity, reflectability, rugosity and more precisely the chemical and/or physical state of the surface. It is also possible to generate the desired fonctionalities, for instance carboxylic acid, ester, ether, amid or imid, during the etching process. The patterning of the different properties may be achieved by two different techniques that may be used separately or simultaneously.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.