Method for forming plating film
US7087315B2 · kind B2 · utility
2Cited by
4References
6Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 21, 2004 |
| Grant date | Aug 8, 2006 |
| Priority date | — |
| Expiry date | Sep 21, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12993
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.