Heat mode-compatible planographic printing plate
US7087362B2 · kind B2 · utility
2Cited by
12References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2003 |
| Grant date | Aug 8, 2006 |
| Priority date | — |
| Expiry date | Dec 15, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/146
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A process for producing a heat mode-compatible positive planographic printing plate precursor comprising a support and a photosensitive layer whose solubility in an aqueous alkali solution increases upon heat-mode exposure, which includes: applying a photosensitive layer coating solution onto the support, and drying the photosensitive layer coating solution at a drying temperature not less than 150° C. and not greater than 200° C. and for a drying time of 110 seconds or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.