Laser separation of encapsulated submount
US7087463B2 · kind B2 · utility
7Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2004 |
| Grant date | Aug 8, 2006 |
| Priority date | — |
| Expiry date | Aug 4, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a light emitting package fabrication process, a plurality of light emitting chips (10) are attached on a sub-mount wafer (14). The attached light emitting chips (10) are encapsulated. Fracture-initiating trenches (30, 32) are laser cut into the sub-mount wafer (14) between the attached light emitting chips (10) using a laser. The sub-mount wafer (14) is fractured along the fracture initiating trenches (30, 32).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.