Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin
US7087702B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2003 |
| Grant date | Aug 8, 2006 |
| Priority date | — |
| Expiry date | Oct 7, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/502
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a cured epoxy resin article. The epoxy resin composition comprises a difunctional epoxy resin (A) having a structure wherein an aromatic hydrocarbon group (a1) having a bonding site in an aromatic nucleus and a hydrocarbon group (a2) having an ether bond or the other hydrocarbon group (a3) are bonded via an acetal bond (a4), and also has a structure wherein a glycidyloxy group is bonded to the aromatic hydrocarbon group (a1); and a curing agent (B) as essential component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.