Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
US7087989B2 · kind B2 · utility
16Cited by
5References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 25, 2004 |
| Grant date | Aug 8, 2006 |
| Priority date | — |
| Expiry date | May 25, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15331
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a first semiconductor package, in which a first semiconductor chip is mounted and a second semiconductor package, in which a second semiconductor chip is mounted and which is supported above the first semiconductor package so as to extend off the first semiconductor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.