Increasing the copper to superconductor ratio of a superconductor wire by cladding with copper-based strip
US7089647B2 · kind B2 · utility
2Cited by
12References
20Claims
0Family size
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Key dates
| Filing date | Feb 19, 2004 |
| Grant date | Aug 15, 2006 |
| Priority date | — |
| Expiry date | Sep 7, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
Abstract
A method for increasing the copper to superconductor ratio of a superconductor core wire by forming a copper-based strip about the core wire which at least partially encloses the core wire in contact therewith by deforming the strip longitudinally into a U shape nested about the wire; and soldering the wire and strip in the assembly of step (a) to form a strong mechanical, electrical and thermal bond therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.