Method for calibrating alignment mark positions on substrates
US7089677B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 5, 2004 |
| Grant date | Aug 15, 2006 |
| Priority date | — |
| Expiry date | Jul 7, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/136
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A novel method for determining whether substrates are correctly positioned on a substrate support in a semiconductor substrate processing or measuring tool for optimum processing or measuring of the substrates. The method includes providing a control substrate; providing alignment marks on the substrate; determining a homing position for the alignment marks on the control substrate wherein the position of the control substrate corresponds to a homing position for optimum processing or measuring of actual substrates; periodically testing the position of the control substrate on the substrate support as facilitated by the substrate transfer and/or substrate positioning equipment of the tool; and determining whether the position of the alignment marks on the control substrate, with respect to the substrate support, stray outside an accepted deviation range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.