Method of centerless grinding
US7090565B2 · kind B2 · utility
4Cited by
40References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2004 |
| Grant date | Aug 15, 2006 |
| Priority date | — |
| Expiry date | Feb 4, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1436
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Organic bonded abrasive tools, having controlled microstructures, comprise a relatively low volume percentage of abrasive grain and a relatively low hardness grade, but are characterized by the excellent mechanical strength and efficient grinding performance of much harder grade, lower porosity tools, especially in versatile grinding processes, such as centerless grinding. A method for centerless grinding with these tools is provided. Methods for making the abrasive tools utilizing agglomerated abrasive grain are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.