Electrically conductive MDF surface
US7090897B2 · kind B2 · utility
23Cited by
7References
21Claims
0Family size
Inventor
Key dates
| Filing date | Oct 10, 2003 |
| Grant date | Aug 15, 2006 |
| Priority date | — |
| Expiry date | Oct 10, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D3/068
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a method and system for implanting a piece of wood or wood composite to improve the electrostatic attraction thereupon. A method is provided for treating a lignocellulosic substrate such as medium density fiberboard (MDF). The method includes implanting a conductive material into the lignocellulosic substrate, pre-heating the implanted lignocellulosic substrate, coating the pre-heated implanted lignocellulosic substrate with a powder solution, and curing the powder coated substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.