Semiconductor device and method for producing the same by dicing
US7091109B2 · kind B2 · utility
4Cited by
22References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2004 |
| Grant date | Aug 15, 2006 |
| Priority date | — |
| Expiry date | Jul 22, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A protective sheet is fixed to a jig, and regions of the protective sheet corresponding to regions where dicing-cut is to be performed are removed to form grooves. Then, a semiconductor wafer is bonded to the protective sheet at an opposite side of the jig, and the jig is detached from the protective sheet and the semiconductor wafer bonded together. After that, the semiconductor wafer is cut into semiconductor chips by dicing along the grooves of the protective sheet. Because the protective sheet is not cut by dicing, no scraps of the protective sheet is produced, thereby preventing contamination to the chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.