Methods and apparatus for patterning a surface
US7091127B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2002 |
| Grant date | Aug 15, 2006 |
| Priority date | — |
| Expiry date | Jan 2, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/60
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The present invention provides methods and apparatus for locally patterning surfaces. In one such method, an oxidizable thioether is adsorbed onto a conductive surface. The surface is then contacted with a fluid medium. A conducting stamp is then brought into contact with the fluid medium above the thioether-coated surface. Next, a potential is applied between the stamp and the surface. It is expected that the charge will be transferred through the medium to the coated surface along a shortest distance path, thereby locally oxidizing the thioether and effectively creating a negative patterned image of the conducting stamp on the surface. Remaining adsorbed thioether may then be used as a mask for standard etching or material addition procedures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.