Highly moisture-sensitive electronic device element and method for fabrication
US7091605B2 · kind B2 · utility
12Cited by
37References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2001 |
| Grant date | Aug 15, 2006 |
| Priority date | — |
| Expiry date | Jan 5, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/851
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.