Piezoelectric ceramic thick film element, array of elements, and devices
US7091650B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2004 |
| Grant date | Aug 15, 2006 |
| Priority date | — |
| Expiry date | Dec 20, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4981
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A piezoelectric thick film element array includes at least one piezoelectric element structure having a thickness between 10 μm to 100 μm formed by a deposition process. The at least one piezoelectric element is patterned during the deposition process, and includes a first electrode deposited on a first surface of the piezoelectric elements structure, and a second electrode deposited on a second surface of the piezoelectric element structure. In a further embodiment, several devices are provided using a piezoelectric element or an array having a piezoelectric element structure with a thickness of between 10 μm to 100 μm formed by a deposition process. These devices include microfluidic ejectors, transducer arrays and catheters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.