Micromechanical resonator having a metal layer surrounding a cylinder formed in a base layer

US7091801B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Ewald Schmidt · Ludwigsburg, DE
• Juergen Hasch · Stuttgart, DE
• Heinz Pfizenmaier · Leonberg, DE

Key dates

• Filing date: Aug 16, 2002
• Grant date: Aug 15, 2006
• Expiry date: Jan 11, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01P7/065
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

The invention relates to a micromechanical resonator having a bondable resonance body and a method for fabricating a micromechanical resonator for semiconductor components.The invention provides that the resonator (26) is composed successively of a first layer (16) of silicon for coupling the resonator (26) in terms of a circuit, an insulating layer (14) of silicon dioxide, a cylindrical base layer (cylinder 18), and a metal layer (20) completely surrounding the cylinder (18).The method provides that a cylindrical structure (18) (cylinder) is etched (trench etching process) in a base layer (12) of p−-doped silicon (SOI wafer) separated from a layer (16) of silicon by an insulating layer (14), and the cylindrical structure (18) is coated with a metal layer (20).