Cooling system for electronic devices utilizing fluid flow and agitation
US7092254B1 · kind B1 · utility
30Cited by
10References
69Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2004 |
| Grant date | Aug 15, 2006 |
| Priority date | — |
| Expiry date | Nov 24, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling system, the system comprises a housing having an inlet and an outlet, a liquid to be flown from the inlet into the housing and out of outlet to exit the housing. The housing further has an interior portion for an electronic device to reside therein and a vibration transducer coupling to the housing. The liquid is flown across the electronic device to dissipate heat from the electronic device. The vibration transducer causes turbulent or agitation in the liquid as the liquid is flown across the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.