Leakage current reduction for CMOS memory circuits
US7092307B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2003 |
| Grant date | Aug 15, 2006 |
| Priority date | — |
| Expiry date | Apr 22, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C2207/2227
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A CMOS integrated circuit (e.g., an SRAM or a DRAM) is partitioned into a core block, a peripheral block, and a retention block. The core block includes circuits (e.g., memory cells) that are powered on at all times and is coupled directly to power supply and circuit ground. The peripheral block includes circuits that may be powered on or off and are coupled to the power supply via a head switch and/or to circuit ground via a foot switch. The switches and the core block may be implemented with high threshold voltage (high-Vt) FET devices to reduce leakage current. The peripheral block may be implemented with low-Vt FET devices for high-speed operation. The retention block includes circuits (e.g., pull-up devices) that maintain signal lines (e.g., word lines) at a predetermined level so that the internal states of the core block are retained when the peripheral block is powered off.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.