Method of manufacturing circuit device using a communication network
US7093210B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2003 |
| Grant date | Aug 15, 2006 |
| Priority date | — |
| Expiry date | Jun 20, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a System In Package (SIP) or Integrated System in Board (ISB) circuit device in which a plurality of circuit elements are covered with and integrally supported by an insulating resin. A user terminal is connected with an ISB server and an ISB mounting factory through a communication network. Specifications to be satisfied by an ISB circuit device desired by a user, such as an external size and terminal information of the ISB and circuit diagram CAD data, for example, are input through the user terminal and transmitted to the ISB server. The ISB server in turn transmits information concerning the due date and cost of the ISB circuit device and also a reliability evaluation result to the user terminal. The ISB server also generates mask data for manufacturing the ISB circuit device based on the input specifications, and transmits the mask data to the ISB mounting factory. The ISB mounting factory, receiving the manufacturing data from the ISB server, manufactures the ISB circuit device and provides the ISB circuit device to the user.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.