Method for fabricating a magnetic transducer using a slurry with spherical particles for CMP-assisted photoresist lift-off
US7094130B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2005 |
| Grant date | Aug 22, 2006 |
| Priority date | — |
| Expiry date | Sep 9, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49032
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method is described which uses a CMP slurry with an abrasive of spherical particles to lift-off photoresist used in the patterning of the sensor for a magnetic transducer. The spherical particles, preferably less than 0.015 microns, are preferably silica, alumina, titania or zirconia with colloidal silica being preferred. An alternative method of fabricating a CPP sensor structure according to the invention deposits a dielectric or CMP resistant metal over the hard bias structure. The CMP-resistant metal is preferably selected from the group consisting of rhodium, chromium, vanadium and platinum. A CMP resistant mask deposited over the dielectric or CMP-resistant metal can include an optional adhesion layer such as tantalum followed by a DLC layer. The CMP-assisted lift-off of the photoresist and the excess materials is executed at this point. The photoresist used to protect the selected area of the sensor structure is lifted-off using the slurry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.