Method for cooling electronic components and thermally conductive sheet for use therewith
US7094459B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 23, 2002 |
| Grant date | Aug 22, 2006 |
| Priority date | — |
| Expiry date | Mar 11, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally conductive sheet includes a thermally conductive layer and an insulation layer laminated onto the thermally conductive layer. The thermally conductive layer includes matrix containing thermally conductive filler having an electrical conductivity. The insulation layer contains thermally conductive filler having an insulating property. The thermally conductive sheet is disposed so that the insulation layer covers the terminal of the electronic component and the electric circuit. At this time, the thermally conductive layer covers and closely contacts with the insulation layer and the electronic component. The heat generated by the electronic component is conducted to a cooling member through the thermally conductive layer and is ultimately dissipated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.