Polymer based tunneling sensor
US7094622B1 · kind B1 · utility
5Cited by
13References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2003 |
| Grant date | Aug 22, 2006 |
| Priority date | — |
| Expiry date | Aug 27, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/038
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A process for fabricating a polymer based circuit by the following steps. A mold of a design is formed through a lithography process. The design is transferred to a polymer substrate through a hot embossing process. A metal layer is then deposited over at least part of said design and at least one electrical lead is connected to said metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.