Patent · US Expired

Semiconductor device and method of manufacturing the same

US7094692B2 · kind B2 · utility

21Cited by
5References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 26, 2004
Grant dateAug 22, 2006
Priority date
Expiry dateOct 26, 2024

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S257/914
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method of manufacturing a semiconductor device having an interconnection part formed of multiple carbon nanotubes is disclosed. The method includes the steps of (a) forming a growth mode control layer controlling the growth mode of the carbon nanotubes, (b) forming a catalyst layer on the growth mode control layer, and (c) causing the carbon nanotubes to grow by heating the catalyst layer by thermal CVD so that the carbon nanotubes serve as the interconnection part. The growth mode control layer is formed by sputtering or vacuum deposition in an atmospheric gas, using a metal selected from a group of Ti, Mo, V, Nb, and W. The growth mode is controlled in accordance with a predetermined concentration of oxygen gas of the atmospheric gas.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.