Light emitting diodes packaged for high temperature operation
US7095053B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2003 |
| Grant date | Aug 22, 2006 |
| Priority date | — |
| Expiry date | Sep 4, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In accordance with the invention, an LED packaged for high temperature operation comprises a metal base including an underlying thermal connection pad and a pair of electrical connection pads, an overlying ceramic layer, and a LED die mounted overlying the metal base. The LED is thermally coupled through the metal base to the thermal connection pad, and the electrodes are electrically connected to the underlying electrical connection pads. A low thermal resistance insulating layer can electrically insulate other areas of die from the base while permitting heat passage. Heat flow can be enhanced by thermal vias to the thermal connector pad. Ceramic layers formed overlying the base can add circuitry and assist in distributing emitted light. The novel package can operate at temperatures as high as 250° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.