Process control and damage monitoring
US7095224B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2004 |
| Grant date | Aug 22, 2006 |
| Priority date | — |
| Expiry date | Jan 21, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N27/904
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A process control method is described which uses measurements from magnetic field sensors to monitor the condition of material, such as from a heat treatment process. The sensors can be single element sensors or sensor arrays, can be used to periodically inspect selected locations, mounted to the test material, or scanned over the test material to generate two-dimensional images of the material properties. The sensors can be exposed to the same process conditions as the material, such as elevated temperatures, or the shielding layers can be placed between the test material and the sensors to reduce sensor exposure to the processing conditions. Additional property measurements, such as sensor lift-off, can be used to ensure proper sensors operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.