High density DSX system
US7095844B2 · kind B2 · utility
11Cited by
34References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2002 |
| Grant date | Aug 22, 2006 |
| Priority date | — |
| Expiry date | Aug 8, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04Q2201/18
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A DSX system arranged to receive a plurality of high-density chassis is disclosed. The chassis include back planes having rear access IN/OUT fields and rear access cross-connect fields. The rear access fields are electrically connected to termination panels located in respective IN/OUT regions and cross-connect regions. Each of the regions includes cable management channels within which system cables are routed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.