Composite structural material, and method of producing the same
US7097914B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2002 |
| Grant date | Aug 29, 2006 |
| Priority date | — |
| Expiry date | Aug 28, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249956
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A plate-shaped composite material has a first member and a second member. The first member is an expanded metal formed of a metal plate. The coefficient of linear expansion of the metal plate is less than or equal to 8×10−6/degrees Celsius. The first member suppresses thermal expansion of the composite material. The coefficient of thermal conductivity of the second member is greater than or equal to 200 W/(m×K). The second member maintains the coefficient of thermal conductivity of the composite material. This structure provides a reliable coefficient of thermal conductivity and high strength. The structure is suitable for a cooling substrate on which electronic elements such as semiconductors are mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.