Method of forming a film of predetermined pattern on a surface as well as device manufactured by employing the same, and method of manufacturing device
US7098121B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2003 |
| Grant date | Aug 29, 2006 |
| Priority date | — |
| Expiry date | May 23, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/0241
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An object is to provide a mask formation method, which can curtail a manufacturing cost.A method of forming a film of predetermined pattern on the front surface of a member to-be-processed is so constructed as to carry out the step (S178) of improving the adherence of a pattern material solution to the member to-be-processed, the step (S180) of filling up a pattern forming recess provided in a mask on the surface of the member to-be-processed with a pattern material solution, the step (S186) of improving the film quality of the pattern film to-be-formed by processing the pattern material solution, the step (S188) of removing the pattern material solution having adhered on the mask, the step (S190) of drying the pattern material solution, and the step (S196) of subjecting the pattern film to annealing processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.