Polyesteramide copolymer
US7098293B2 · kind B2 · utility
2Cited by
7References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 2002 |
| Grant date | Aug 29, 2006 |
| Priority date | — |
| Expiry date | May 2, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/254
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyesteramide copolymer having a glass transition temperature (Tg) of less than or equal to 0° C., contains at least one hard segment containing at least one amide bond, and at least one soft segment containing at least one ester bond. The soft segment is formed from at least one dimer fatty acid and/or dimer fatty diol and/or equivalent thereof. The copolymer is particularly suitable for use as a hot melt adhesive on low energy surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.