Techniques for mounting an area array package to a circuit board using an improved pad layout
US7098408B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2003 |
| Grant date | Aug 29, 2006 |
| Priority date | — |
| Expiry date | Feb 9, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board assembly includes a printed circuit board (PCB). The PCB has a pad layout which includes a set of pads arranged in a two-dimensional array having at least two pads in a first direction and at least two pads in a second direction that is substantially perpendicular to the first direction. Each pad has (i) a central portion and (ii) multiple lobe portions integrated with the central portion and extending from the central portion of that pad. The circuit board assembly further includes a circuit board component mounted to the pad layout via a set of solder joints. The above-described pad layout (or land pattern) is well-suited for soldering to a variety of AAP devices (e.g., either a CCGA device or a BGA device).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.