System and method for an improved susceptor
US7098428B1 · kind B1 · utility
Inventors
Key dates
| Filing date | Jan 26, 2005 |
| Grant date | Aug 29, 2006 |
| Priority date | — |
| Expiry date | Jan 26, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/143
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A susceptor including a substrate support and a conductor is provided. The substrate support includes a conductive element, a contact bonded to the conductive element, and a bushing. The conductor is disposed through the bushing and is bonded to the contact. The substrate support can also include a conductive spreader between the contact and the conductive element. A method for fabricating a susceptor is also provided. The method comprises forming a plate including a bushing preform, sintering or hot-pressing a conductive element and a contact between a ceramic layer and the plate to produce a substrate support, forming a conductor opening into the substrate support and through the bushing preform to the contact, and bonding a conductor into the conductor opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.