Structure manufacturing method
US7100263B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2004 |
| Grant date | Sep 5, 2006 |
| Priority date | — |
| Expiry date | Jan 20, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49996
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A liquid application material that is capable of forming an oxidized insulator as a result of baking is applied onto a support substrate to produce an object of processing. Then, a mold having projection structures with intervals of nanometers is pressed against the applied liquid material to produce corresponding recess structures. Thereafter, the applied liquid material is baked in oxygen-containing gas or oxidized in ozone or oxygen plasma to make it electrically highly resistive. Subsequently, a layer to be anodized is formed on said oxidized insulator. Then, the layer to be anodized is actually anodized in an acidic solution to form fine holes that are aligned with the respective recess structures in the anodized layer. Accordingly, fine recess structures can be manufactured with ease.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.