Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test
US7100389B1 · kind B1 · utility
42Cited by
37References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2002 |
| Grant date | Sep 5, 2006 |
| Priority date | — |
| Expiry date | Feb 25, 2023 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B41/37
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and method for controlling the temperature of an electronic device under test utilizes a thermal head spaced apart from a movable support structure by a mechanical isolation assembly. The support structure has a manifold configured to route refrigerant fluid between the evaporator head and components of a refrigeration system. The mechanical isolation assembly is configured to compensate for variations in the planar orientation of the device under test. Moreover, the mechanical isolation assembly preferably includes bellows through which the refrigerant fluid is conducted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.