Integrated circuit heat pipe heat spreader with through mounting holes
US7100680B2 · kind B2 · utility
18Cited by
38References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2005 |
| Grant date | Sep 5, 2006 |
| Priority date | — |
| Expiry date | Aug 9, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The apparatus is a heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.