Leadframe-based housing, leadframe strip, surface-mounted optoelectronic-component, and production method

US7102213B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventor

• Jörg Erich Sorg · Regensburg, DE

Key dates

• Filing date: Sep 5, 2003
• Grant date: Sep 5, 2006
• Expiry date: Sep 5, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/12041

Abstract

A leadframe-based housing for a surface-mountable component, particularly a radiation-emitting component. The leadframe-based housing comprises electrical connector strips and at least one chip mounting area. One of the connector strips includes an injection aperture that enables a leadframe-based housing to be produced with a very small thickness in an injection molding process. A method for producing such housings is further specified.