RFID device and method of forming
US7102520B2 · kind B2 · utility
106Cited by
29References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2004 |
| Grant date | Sep 5, 2006 |
| Priority date | — |
| Expiry date | Nov 23, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15153
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A radio frequency identification (RIFD) inlay includes an interposer that has a chip, and an antenna on an antenna substrate. The antenna substrate has a recess or hole, and the chip is at least partially in the recess or hole. By placing the chip or the interposer face down and at least partially in a recess or hole, thickness of the inlay may be reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.