Heat sink retention device
US7102890B2 · kind B2 · utility
9Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2004 |
| Grant date | Sep 5, 2006 |
| Priority date | — |
| Expiry date | Feb 6, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The retention device comprises a clip and a back plate engaging the clip, the clip comprises pressing members for press the heat sink onto the processor and at least a pair of hooks, the back plate is placed below a printed circuit board on which the processor is mounted, and comprises a body and at least a pair of retaining rings mounted thereof. The retaining rings travel through mounting holes in the printed circuit board and beyond the top surface thereof for catching the hooks of the clip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.