Electronic component module
US7102896B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2004 |
| Grant date | Sep 5, 2006 |
| Priority date | — |
| Expiry date | May 18, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/183
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component module according to the invention includes: a mounting substrate 11 including a shield layer 13 and on which a first cavity 14a and a second cavity 14b are formed; a first electronic component 16a positioned in the first cavity 14a and used in a first frequency band; a second electronic component 16b positioned in the second cavity 14b and used in a second frequency band; lid members 15 which seal the first cavity 14a and the second cavity 14b; and patch antennas 17 which transmit/receive radio waves in the frequency bands, the antennas connected to the electronic components 16; wherein the electronic components 16 are mounted on the mounting substrate 11 via a substrate component 19 having a higher heat resistance than the mounting substrate 11 and that the mounting substrate 11 is composed of a member having a lower dielectric constant that the substrate component 19.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.