High density integrated optical chip
US7103245B2 · kind B2 · utility
35Cited by
47References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2002 |
| Grant date | Sep 5, 2006 |
| Priority date | — |
| Expiry date | Jan 9, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12176
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A high density integrated optical chip. The optical chip features an optical function connected to a low minimum bending radius dielectric waveguide, and a large mode field size dielectric waveguide to interface with an external optical device, such as an optical fiber. The large mode field size dielectric waveguide is optically connected to the low minimum bending radius dielectric waveguide on the optical chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.