Heat pump
US7104079B2 · kind B2 · utility
9Cited by
12References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2002 |
| Grant date | Sep 12, 2006 |
| Priority date | — |
| Expiry date | Jul 2, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02A40/963
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat pump apparatus that having a refrigerating cycle including a compressor, a gas cooler, a pressure reducing device and an evaporator and is designed so that water can be heated by the gas cooler. A refrigerant such as CO2 or the like working in a supercritical area is filled and used at a high-pressure side in the refrigerating cycle and a radiator is equipped between the exit of the gas cooler and the pressure reducing device. The refrigerant temperature at the exit of the radiator is kept at a substantially fixed temperature irrespective of the temperature of hot water to the gas cooler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.