Vertically integrated MEMS structure with electronics in a hermetically sealed cavity
US7104129B2 · kind B2 · utility
168Cited by
22References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2004 |
| Grant date | Sep 12, 2006 |
| Priority date | — |
| Expiry date | Aug 4, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0831
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A MEMS assembly having a MEMS subassembly sandwiched between and bonded to a cap and a base is provided. The MEMS subassembly includes at least one MEMS device element flexibly connected to the MEMS assembly. The vertical separation between the MEMS device element and an electrode on the base is lithographically defined. Precise control of this critical vertical gap dimension is thereby provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.